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Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and ...
Fracture Analysis of Adhesively Bonded Sheets
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The problem of adhesively bonded sheets, one of which is cracked, is formulated by the utilization of integral transform methods. The objective of the investigation is to calculate the ...